80+ RIE
Tool managers:
- Hiromichi Yamamoto (hyam[at]seas[dot]upenn[dot]edu)
- Nicholas Schneider (schnic[at]seas[dot]upenn[dot]edu)
- Zhenyang Xia (zhenyxia[at]seas[dot]upenn[dot]edu)
- Kyle Keenan (kckeenan[at]seas[dot]upenn[dot]edu)
For operating instructions go to the nanofab wiki (PennKey required for login).
The 80+ is a parallel-plate reactive ion etcher (RIE). The tool has a fluorine-based chemistry: CHF3, CF4, SF6, O2, and Ar.
The following materials are typically etched: silicon, silicon oxide, and silicon nitride.
A 600 Watt RF generator with automatic matching network is close-coupled to the lower
electrode.
The temperature of the lower electrode is controlled by a Thermo RTE7 Digital Plus
chiller.
The tool uses an Alcatel ATP 400 l/s turbo pump for high vacuum generation.