Wafer Bond Aligner
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EVG620 Bond Alignment System makes wafer-to-wafer alignment for EVG510 wafer bonder, using the bottom side microscopes through windows. After the alignment, the sample chuck clamping the wafers can directly be set onto EVG510 wafer bonder.
Substrate size: WNF currently has tooling for bonding 4" diameter substrate/wafers. Tooling for other substrate sizes can be purchased from EVG.
Maximum stack height: 4.5 mm
Range of alignment: X, Y ± 5.0 mm
Contact force: 1-40 N