Wet Processing Wafer Chuck

• Wafer size: 4"
• Material of the chuck: Polyether ether ketone (PEEK)
  • Resistant to most of the etching solutions used in microfabrication (HF, KOH, TMAH)
• Wet processing wafer chuck protects the back side of the wafer from being etched.
  • In this way, deep structures can be etched without need to mask the back side.
• The chuck consists of a wafer holder and a clamping ring.
  • The wafer is placed on the holder and fixed by the clamping ring, which is screwed to the chuck.
  • Three precision sealing rings ensure a leak-proof clamping of the wafer.
• A user-defined recess in the holder minimizes the stress on the clamped wafer.
• For the fabrication of thin membranes, a ventilation tube, connecting the enclosed air in the chuck to the atmospheric pressure, can be added.
  • This is highly recommended if the etching solution is heated.