Resists and Their Supplements

Updated on 4/20/2015

Nano- and micro-fabrication can be done using positive or negative resist films, as described in Introduction to Nanofabrication. This section contains recipes of various resists films and their supplements used in Penn Nanofab.

Notes

Do not dispense resist from the large bottles; make your own dispense bottle.
Discard pipettes with unused resist; do not put the resist solution back into the bottle.
Work well within the bench so that solvent vapors do not spread into the lab.
Do not expose the resist solution to air for too long; humidity affects the resolution of lithography.
Total Exposure: mJ/cm2 = sec x mW/cm2
See Reference Photoresist.

1 Positive resists

1.1 Description

1.2 Recipes

2 Negative resists

2.1 Description

2.2 Recipes

3 Adhesion Promoters

3.1 Description

3.2 Recipes

1. Positive resists

1.1 Description

In a positive resist the portion that is exposed to radiation becomes soluble in the developer. The portion of the resist that is unexposed remains insoluble to the developer.

1.2 Recipes

Photolithography

E-beam lithography

2. Negative resists

2.1 Description

In a negative resist the portion exposed to radiation becomes insoluble to the developer. The unexposed portion of the resist is dissolved by the developer.

2.2 Recipes

Photolithography

E-beam lithography
- HSQ
- NEB-31A3
- Comparison of E-beam resists

3. Adhesion Promoters

3.1 Description

Adhesion promoters are applied to a substrate to enhance the bond strength between a surface coating (e.g. resist) and the substrate (e.g. silicon, GaAs). The adhesion promoter is coated on the substrate and then the resist film is applied.